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FBI fingerprint module

FBI fingerprint modules comply with international standards such as ISO 19794-2, ISO 19794-4, ANSI 378, ANSI 381 and WSQ

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The FBI fingerprint module ID_A360 is a semiconductor fingerprint module that supports the US FBI PIV and Indian STQC certification and complies with international standards such as ISO and ANSI. With a dedicated high-performance ID808 processor as its core, a large area semiconductor sensor and the built-in IDFinger fingerprint recognition algorithm, which is loved by users worldwide, it has a large effective area for fingerprint images, low power consumption, fast acquisition, strong adaptability to wet and dry fingers and high anti-forgery features, which can accurately capture and identify all kinds of fingerprints, effectively reject all kinds of fake fingers and fake fingerprints and other deceptive behaviour, to meet Large-scale fingerprint collection and authentication requirements. The module is compact and can be flexibly embedded in various hardware terminals that need to comply with international certification standards.



Technical parameters.

Sensor size: 35*23*3.5 mm.

Sensor type: semiconductor capacitive

Acquisition method: press type

Acquisition window size: 14.25*19.3 mm

Effective image size: 12.8*18 mm

Image size: 256*360pixel

Image resolution: 508dpi

Image distortion: ≤1%

False recognition rate (FAR): <0.0001%

Rejection rate (FRR): <1%

Matching time: <0.1 sec (1:1), <0.5 sec (1:N ,100 pcs)

Communication interface: USB1.1/2.0; SPI

Support systems: Windows; Android.

Operating voltage: 5V

Operating current: 50mA

Static protection: Contact discharge: ± 8KV Air discharge: ± 15KV

Operating temperature: 0°C to 55°C

Storage temperature: -40°C to 60°C

Operating humidity: <90% R.H

Storage humidity: 20 to 93% R.H



FBI fingerprint modules are widely used in government, education, medical, financial, social security and other industries that require authentication and security control through fingerprints.


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