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The FBI Certified Fingerprint Module complies with international standards such as ISO19794-2, ISO19794-4, ANSI 378, ANSI 381, and WSQ
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The FBI Certified Fingerprint Module ID_A360 is a semiconductor fingerprint module that supports the US FBI PIV and Indian STQC certification and complies with international standards such as ISO and ANSI. With a dedicated high-performance ID808 processor as its core, a large area semiconductor sensor and the built-in IDFinger fingerprint recognition algorithm, which is loved by users worldwide, it has a large effective area for fingerprint images, low power consumption, fast acquisition, strong adaptability to wet and dry fingers and high anti-forgery features, which can accurately capture and identify all kinds of fingerprints, effectively reject all kinds of fake fingers and fake fingerprints and other deceptive behaviour, to meet Large-scale fingerprint collection and authentication requirements. The modules is compact and can be flexibly embedded in various hardware terminals that need to comply with international certification standards.
Features：
Support US FBI PIV Mobile ID FAP 10 and Indian STQC standard;
Comply with ISO19794-2, ISO19794-4, ANSI 378, ANSI 381, WSQ and other international standards;
Ultra-thin structure, easy to design and integrate product structure;
Capacitive fingerprint acquisition technology, the image quality is clear;
IDFinger fingerprint recognition algorithm, support self-learning function, so that dry, wet, rough fingers have good imaging effect;
Support for Windows, Android, Linux and other embedded operating systems;
Provide complete SDK development kit.
Specifications：
Technical parameters.
Sensor size: 35*23*3.5 mm.
Sensor type: semiconductor capacitive
Acquisition method: press type
Acquisition window size: 14.25*19.3 mm
Effective image size: 12.8*18 mm
Image size: 256*360pixel
Image resolution: 508dpi
Image distortion: ≤1%
False recognition rate (FAR): <0.0001%
Rejection rate (FRR): <1%
Matching time: <0.1 sec (1:1), <0.5 sec (1:N ,100 pcs)
Communication interface: USB1.1/2.0; SPI
Support systems: Windows; Android.
Operating voltage: 5V
Operating current: 50mA
Static protection: Contact discharge: ± 8KV Air discharge: ± 15KV
Operating temperature: 0°C to 55°C
Storage temperature: -40°C to 60°C
Operating humidity: <90% R.H
Storage humidity: 20 to 93% R.H
FBI Certified Fingerprint Module are widely used in government, education, medical, financial, social security and other industries that require authentication and security control through fingerprints.
The FBI Certified Fingerprint Module ID_A360 is a semiconductor fingerprint module that supports the US FBI PIV and Indian STQC certification and complies with international standards such as ISO and ANSI. With a dedicated high-performance ID808 processor as its core, a large area semiconductor sensor and the built-in IDFinger fingerprint recognition algorithm, which is loved by users worldwide, it has a large effective area for fingerprint images, low power consumption, fast acquisition, strong adaptability to wet and dry fingers and high anti-forgery features, which can accurately capture and identify all kinds of fingerprints, effectively reject all kinds of fake fingers and fake fingerprints and other deceptive behaviour, to meet Large-scale fingerprint collection and authentication requirements. The modules is compact and can be flexibly embedded in various hardware terminals that need to comply with international certification standards.
Features：
Support US FBI PIV Mobile ID FAP 10 and Indian STQC standard;
Comply with ISO19794-2, ISO19794-4, ANSI 378, ANSI 381, WSQ and other international standards;
Ultra-thin structure, easy to design and integrate product structure;
Capacitive fingerprint acquisition technology, the image quality is clear;
IDFinger fingerprint recognition algorithm, support self-learning function, so that dry, wet, rough fingers have good imaging effect;
Support for Windows, Android, Linux and other embedded operating systems;
Provide complete SDK development kit.
Specifications：
Technical parameters.
Sensor size: 35*23*3.5 mm.
Sensor type: semiconductor capacitive
Acquisition method: press type
Acquisition window size: 14.25*19.3 mm
Effective image size: 12.8*18 mm
Image size: 256*360pixel
Image resolution: 508dpi
Image distortion: ≤1%
False recognition rate (FAR): <0.0001%
Rejection rate (FRR): <1%
Matching time: <0.1 sec (1:1), <0.5 sec (1:N ,100 pcs)
Communication interface: USB1.1/2.0; SPI
Support systems: Windows; Android.
Operating voltage: 5V
Operating current: 50mA
Static protection: Contact discharge: ± 8KV Air discharge: ± 15KV
Operating temperature: 0°C to 55°C
Storage temperature: -40°C to 60°C
Operating humidity: <90% R.H
Storage humidity: 20 to 93% R.H
FBI Certified Fingerprint Module are widely used in government, education, medical, financial, social security and other industries that require authentication and security control through fingerprints.
