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FBI certified fingerprint module

The FBI Certified Fingerprint Module complies with international standards such as ISO19794-2, ISO19794-4, ANSI 378, ANSI 381, and WSQ

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The FBI Certified Fingerprint Module ID_A360 is a semiconductor fingerprint module that supports the US FBI PIV and Indian STQC certification and complies with international standards such as ISO and ANSI. With a dedicated high-performance ID808 processor as its core, a large area semiconductor sensor and the built-in IDFinger fingerprint recognition algorithm, which is loved by users worldwide, it has a large effective area for fingerprint images, low power consumption, fast acquisition, strong adaptability to wet and dry fingers and high anti-forgery features, which can accurately capture and identify all kinds of fingerprints, effectively reject all kinds of fake fingers and fake fingerprints and other deceptive behaviour, to meet Large-scale fingerprint collection and authentication requirements. The modules is compact and can be flexibly embedded in various hardware terminals that need to comply with international certification standards.

Features:

Support US FBI PIV Mobile ID FAP 10 and Indian STQC standard;

Comply with ISO19794-2, ISO19794-4, ANSI 378, ANSI 381, WSQ and other international standards;

Ultra-thin structure, easy to design and integrate product structure;

Capacitive fingerprint acquisition technology, the image quality is clear;

IDFinger fingerprint recognition algorithm, support self-learning function, so that dry, wet, rough fingers have good imaging effect;

Support for Windows, Android, Linux and other embedded operating systems;

Provide complete SDK development kit.

Specifications:

Technical parameters.

Sensor size: 35*23*3.5 mm.

Sensor type: semiconductor capacitive

Acquisition method: press type

Acquisition window size: 14.25*19.3 mm

Effective image size: 12.8*18 mm

Image size: 256*360pixel

Image resolution: 508dpi

Image distortion: ≤1%

False recognition rate (FAR): <0.0001%

Rejection rate (FRR): <1%

Matching time: <0.1 sec (1:1), <0.5 sec (1:N ,100 pcs)

Communication interface: USB1.1/2.0; SPI

Support systems: Windows; Android.

Operating voltage: 5V

Operating current: 50mA

Static protection: Contact discharge: ± 8KV Air discharge: ± 15KV

Operating temperature: 0°C to 55°C

Storage temperature: -40°C to 60°C

Operating humidity: <90% R.H

Storage humidity: 20 to 93% R.H

FBI Certified Fingerprint Module are widely used in government, education, medical, financial, social security and other industries that require authentication and security control through fingerprints.

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